Solder Bump Configurations in Circuitry and Methods of Manufacture Thereof

A chip package comprising:

• a printed circuit board;
• an integrated circuit configured to perform a electronic function;
• and
• a plurality of solder bumps on a bottom surface of the integrated circuit, the plurality of solder bumps configured to provide conductive connectivity between the integrated circuit and the printed circuit board, the plurality of solder bumps comprising a first group of solder bumps located within a center region of the bottom surface of the integrated circuit and a second group of solder bumps located within a peripheral region of the bottom surface of the integrated circuit, the peripheral region surrounding the center region,
• wherein all signals required for the integrated circuit to perform the electronic function are provided by way of the first group of solder bumps.

A method comprising:

• providing an integrated circuit configured to perform an electronic function associated with a hearing device;
• and
• forming a plurality of solder bumps on a bottom surface of the integrated circuit, the plurality of solder bumps configured to provide conductive connectivity between the integrated circuit and a printed circuit board, the plurality of solder bumps comprising a first group of solder bumps located within a center region of the bottom surface of the integrated circuit and a second group of solder bumps located within a peripheral region of the bottom surface of the integrated circuit, the peripheral region surrounding the center region,
• wherein all signals required for the integrated circuit to perform the electronic function are provided by way of the first group of solder bumps.