Semiconductor device package structure and manufacturing method thereof

A semiconductor component packaging structure, comprising:

• a redistribution structure;
• a first semiconductor device disposed on a first side of the redistribution structure;
• a second semiconductor device;
• a bridge die, wherein the second semiconductor device and the bridge die are disposed on a second side of the redistribution structure, and the first side is opposite to the second side;
• a first conductive bump disposed on the first semiconductor device;
• a second conductive bump disposed on the second side of the redistribution structure;
• a third conductive bump disposed on the second semiconductor device and opposite to the second conductive bump;
• and
• a first solder material electrically connected between the second conductive bump and the third conductive bump, and the redistribution structure being electrically connected between the first conductive bump and the second conductive bump.

A method for manufacturing a semiconductor device package structure, comprising:

• forming a first redistribution structure on a first carrier;
• disposing a first semiconductor device on the first redistribution structure, the first semiconductor device comprising a first conductive bump;
• forming a first filling layer to cover the first semiconductor device, and curing the first filling layer;
• forming a second redistribution structure on the first filling layer, the second redistribution structure comprising a second conductive bump;
• disposing a second semiconductor device on the second redistribution structure, the second semiconductor device comprises a third conductive bump and a first solder material, the third conductive bump is disposed opposite to the second conductive bump, the first solder material is electrically connected between the second conductive bump and the third conductive bump, and the second redistribution structure is electrically connected between the first conductive bump and the second conductive bump.