Circuit board and method of manufacturing circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorKyehwan Lee
Life of this patent
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Abstract
A circuit board includes: a first insulating layer; a second insulating layer positioned on the first insulating layer; and a first pad portion and a second pad portion which are partially buried in the first insulating layer, protrude from the second insulating layer, and have different thicknesses. The first pad portion and the second pad portion each include a first layer and a second layer positioned on the first layer, and heights of the first layer of the first pad portion and the first layer of the second pad portion are lower than a height of the first insulating layer.
Claims26
A circuit board, comprising:
- a first insulating layer;
- a second insulating layer positioned on the first insulating layer;
- and
- a first pad portion and a second pad portion which are partially buried in the first insulating layer, protrude from the second insulating layer, and have different thicknesses,
- wherein the first pad portion and the second pad portion each include a first layer and a second layer positioned on the first layer, and
- heights of the first layer of the first pad portion and the first layer of the second pad portion are lower than a height of the first insulating layer.
A method of manufacturing a circuit board, the method comprising:
- forming, in a first insulating layer, a first layer of a first pad portion and a first layer of a second pad portion;
- forming, on the first insulating layer, a second insulating layer having a first opening overlapping the first layer of the first pad portion and a second opening overlapping the first layer of the second pad portion;
- forming a second layer of the first pad portion to be positioned on the first layer of the first pad portion within the first opening in a state where the second opening is covered with a first mask;
- and
- forming a second layer of the second pad portion to be positioned on the first layer of the second pad portion within the second opening in a state where the first opening is covered with a second mask,
- wherein a thickness of the second layer of the first pad portion is different from a thickness of the second layer of the second pad portion.
A circuit board, comprising:
- a first insulating layer;
- a second insulating layer positioned on the first insulating layer;
- and
- a first pad portion and a second pad portion which are partially buried in the first insulating layer and protrude from an upper surface of the second insulating layer to have different heights with respect to the upper surface of the second insulating layer,
- wherein the first pad portion and the second pad portion each include a first layer and a second layer disposed on the first layer, and
- the first layer of the first pad portion and the first layer of the second pad portion include a first metal, and the second layer of the first pad portion and the second layer of the second pad portion have different thicknesses and include a second metal different from the first metal.
Dependencies are inferred from the claim text.