Electronic device and electronic device manufacturing method

An electronic device manufacturing method, comprising:

• preparing a substrate being rectangular in a plan view of an electronic device and a first terminal having a first bonding region, the substrate including an insulating plate having a front surface and a rear surface opposite to the front surface, a first circuit pattern layer provided on the front surface of the insulating plate, and a metal plate provided on the rear surface of the insulating plate, the first circuit pattern layer having a first terminal region extending in a long-side direction of the substrate;
• and
• bonding the first bonding region of the first terminal to the first terminal region of the first circuit pattern layer via a first bonding material, wherein
• a thickness of the first bonding region of the first terminal is less than a thickness of the first terminal region of the first circuit pattern layer, and
• a length in the long-side direction of the first bonding region of the first terminal is greater than or equal to half a length in the long-side direction of the first terminal region of the first circuit pattern layer.