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US 2024/0178099 A1Published application
Power module and method for producing same
AssigneeAmosense Co., Ltd.
InventorJihyung LEE
Life of this patent
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Abstract
The present invention relates to a power module and a method for producing same, in which the bottom electrode layer of a ceramic substrate is inserted into recesses of a base plate, and with the ceramic substrate stacked on the base plate, adhesion via brazing is carried out, thus improving adhesion reliability, preventing flexure, and provides highly efficient heat dissipation.
Claims16
A power module comprising:
- a ceramic substrate;
- and
- a base plate bonded onto a lower part of the ceramic substrate,
- wherein the ceramic substrate includes:
- a ceramic base material;
- an upper electrode layer formed on an upper surface of the ceramic base material;
- and
- a lower electrode layer formed on a lower surface of the ceramic base material and separated into a plurality of areas, and
- wherein the base plate has a plurality of recess grooves formed thereon to correspond to the lower electrode layer, and the lower electrode layer is inserted into the recess grooves.
6 more elements
A method for producing a power module comprising:
- preparing an upper electrode layer and a lower electrode layer on upper and lower surfaces of a ceramic base material, and preparing a ceramic substrate on which the lower electrode layer is separated into a plurality of areas;
- preparing a base plate having a recess groove formed thereon to correspond to the lower electrode layer;
- inserting the lower electrode layer into the recess groove;
- and
- bonding the ceramic substrate on the base plate in a laminated state.
2 more elements
Dependencies are inferred from the claim text.