Sic-based electronic device with multilayer and multifunctional passivation, and method of manufacturing the electronic device
AssigneeSTMicroelectronics International N.V.
InventorsGabriele BELLOCCHI, Simone RASCUNA', Valeria PUGLISI
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Abstract
Electronic device, comprising: a solid body including a Silicon Carbide substrate, and further including an electrical terminal of the electronic device on the substrate; a passivation layer on the electrical terminal, of a first material; and a first adhesion improving layer coupled to the passivation layer and to the solid body, of a second material having predefined characteristics of adhesion to the first material, and configured to bond together the passivation layer and the solid body.
Claims20
An electronic device, comprising:
- a solid body including an electrical terminal of the electronic device on the solid body;
- a passivation layer on the electrical terminal, of a first material, the passivation layer having a top surface, a bottom surface facing the solid body, and lateral surfaces which connect the top surface to the bottom surface;
- and
- a first adhesion improving layer coupled to the passivation layer and to the solid body, the first adhesion improving layer comprising a second material having selected characteristics of adhesion to the first material, and configured to bond together the passivation layer and the solid body.
A method for manufacturing an electronic device, comprising:
- forming, in a solid body, a plurality of ohmic contacts;
- forming an electrical terminal of the electronic device coupled to the plurality of ohmic contacts on the solid body;
- forming a passivation layer, of a first material, on the electrical terminal, the passivation layer having a first surface, a second surface opposite the first surface facing the solid body, and a plurality of lateral surfaces coupling the first surface to the second surface;
- and
- forming a first adhesion improving layer directly coupled to the passivation layer and to the solid body, wherein the first adhesion improving layer is of a second material having selected characteristics of adhesion to the first material, and is configured to bond together the passivation layer and the solid body.
A device, comprising:
- a substrate with a first surface opposite a second surface in a first direction;
- a plurality of ohmic contacts in the first surface of the substrate, the plurality of ohmic contacts spaced from one another along a second direction transverse to the first direction;
- an insulating layer on the first surface of the substrate, the insulating layer spaced along the second direction from the plurality of ohmic contacts;
- a conductive layer on the first surface of the substrate, the conductive layer having a first surface opposite a second surface, the second surface of the conductive layer being coupled directly to the plurality of ohmic contacts and partially covering the insulating layer along the second direction;
- a passivation layer coupled to the first surface of the conductive layer;
- and
- a first encapsulation layer coupled between the passivation layer and the first surface of the conductive layer.
Dependencies are inferred from the claim text.