Substrate processing apparatus and substrate processing method

A substrate processing method using a substrate processing apparatus, wherein the substrate processing apparatus includes:

• a housing having a processing space defined therein in which a substrate is processed;
• a substrate support installed in the processing space so as to be rotatable about a rotation axis and configured to support the substrate;
• a chemical liquid supply disposed on top of the substrate support and configured to spray a chemical liquid toward an upper surface of the substrate supported on the substrate support;
• and
• a controller configured to repeatedly apply a first rotation control signal and a second rotation control signal indicating different rotation speeds to the substrate support so as to generate an inertial behavior of the chemical liquid coated on the substrate due to change in a rotation speed of the substrate support in a process of coating the chemical liquid on the substrate,
• wherein the method comprises:
• a substrate loading step in which the substrate is loaded onto and supported on the substrate support in the processing space of the housing;
• and
• a chemical liquid coating step of spraying the chemical liquid toward the upper surface of the substrate and coating the chemical liquid on the substrate by rotating the substrate while changing a rotation speed of the substrate to different rotation speeds.

A substrate processing method using a substrate processing apparatus, wherein the substrate processing apparatus includes:

• a housing having a processing space defined therein in which a substrate is processed;
• a substrate support installed in the processing space so as to be rotatable about a rotation axis and configured to support the substrate;
• a chemical liquid supply disposed on top of the substrate support and configured to spray a chemical liquid toward an upper surface of the substrate supported on the substrate support;
• and
• a controller configured to repeatedly apply a first rotation control signal and a second rotation control signal indicating different rotation speeds to the substrate support so as to generate an inertial behavior of the chemical liquid coated on the substrate due to change in a rotation speed of the substrate support in a process of coating the chemical liquid on the substrate,
• wherein the method comprises:
• a substrate loading step in which the substrate is loaded onto and supported on the substrate support in the processing space of the housing;
• and
• a chemical liquid coating step of spraying the chemical liquid toward the upper surface of the substrate and coating the chemical liquid on the substrate by rotating the substrate while changing a rotation speed of the substrate to different rotation speeds,
• wherein the chemical liquid coating step includes:
• applying the first rotation control signal to the substrate support to allow the substrate support to rotate at a first rotation speed;
• and
• applying the second rotation control signal to the substrate support while the rotation of the substrate support is not stopped to allow the substrate support to rotate at a second rotation speed different from the first rotation speed,
• wherein the chemical liquid coating step includes periodically and repeatedly applying the first rotation control signal and the second rotation control signal at a regular interval,
• wherein the chemical liquid coating step includes maintaining a difference between the first rotation speed and the second rotation speed in a range of 500 rpm to 750 rpm,
• wherein the chemical liquid coating step includes maintaining the first rotation speed in a range of 1500 rpm to 2000 rpm, and maintaining the second rotation speed in a range of 750 rpm to 1500 rpm,
• wherein the chemical liquid coating step includes applying the first rotation control signal for a first time, and then applying the second rotation control signal for a second time, wherein the first time and the second time are equal to each other, wherein each of the first time and the second time is in a range of 1 second to 5 seconds,
• wherein the substrate processing method further comprises:
• after the chemical liquid coating step,
• peeling off the chemical liquid coated on the substrate to remove particles physically attached to an area of the substrate;
• and
• cleaning the substrate from which the chemical liquid has been peeled off;
• and
• drying the cleaned substrate.