Coating method, processing apparatus, non-transitory computer-readable recording medium, substrate processing method and method of manufacturing semiconductor device

A processing apparatus comprising:

• a process vessel;
• a gas supplier configured to supply a first process gas, a second process gas different from the first process gas and a third process gas different from each of the first process gas and the second process gas to the process vessel;
• and
• a controller configured to be capable of controlling the gas supplier so as to perform:
• (a) supplying a first process gas to a process vessel;
• (b) supplying a second process gas different from the first process gas to the process vessel;
• (c) supplying a third process gas different from each of the first process gas and the second process gas to the process vessel;
• (d) performing a first cycle X times, the first cycle comprising performing (a) and (b);
• (e) performing a second cycle Y times, the second cycle comprising performing (d) and (c);
• and
• (f) changing X in a next execution of the second cycle according to the number of previous executions of the second cycle in (e).

A substrate processing method comprising:

• (a) supplying a first process gas to a process vessel;
• (b) supplying a second process gas different from the first process gas to the process vessel;
• (c) supplying a third process gas different from each of the first process gas and the second process gas to the process vessel;
• (d) performing a first cycle X times, the first cycle comprising performing (a) and (b);
• (e) performing a second cycle Y times, the second cycle comprising performing (d) and (c);
• (f) changing X in a next execution of the second cycle according to the number of previous executions of the second cycle in (e);
• and
• (g) loading a substrate into the process vessel and processing the substrate after (e).