Method of Conductive Material Deposition

A method for processing a substrate, the method comprising:

• depositing a filling material over the substrate comprising line recesses, the filling material filling the line recesses;
• patterning the filling material such that every other line of the line recesses is reopened while a remainder of the line recesses remains filled with the filling material;
• depositing a conductive material over the substrate, the conductive material filling the reopened line recesses to a first height;
• performing an etch back process to etch the conductive material such that the every other line of the line recesses is filled with the conductive material to a second height that is lower than the first height;
• etching the filling material to reopen the remainder of the line recesses;
• and
• filling every line recess with the conductive material to a third height.

A method for processing a substrate, the method comprising:

• depositing a first filling material over the substrate comprising a first recess and a second recess, the first filling material filling the first recess and the second recess;
• patterning the first filling material such that the first recess is reopened while the second recess remains filled with the filling material;
• depositing a conductive material over the substrate, the conductive material filling the first recess to a first height;
• performing a first etch back process to etch the conductive material such that the first recess is filled with the conductive material to a second height that is lower than the first height;
• depositing a second filling material such that the first recess is filled with the conductive material and the second filling material;
• etching the first filling material selectively to the conductive material and the second filling material to reopen the second recess;
• redepositing the conductive material over the substrate, the conductive material filling the second recess;
• and
• performing a second etch back process to etch the conductive material such that the first recess and the second recess are filled with the conductive material to the second height.