Semiconductor fabricating system having hybrid brush assembly

A method, comprising:

• placing a wafer over a wafer stage;
• moving a brush assembly toward the wafer to contact with the wafer, wherein the brush assembly comprises an inner brush member and an outer brush member laterally surrounding the inner brush member, wherein from a cross-sectional view, the outer brush member having a level top surface, a vertical inner surface, and a beveled inner surface connecting the level top surface and the vertical inner surface;
• and
• rotating the brush assembly relative to the wafer.

A semiconductor fabricating system, comprising:

• a wafer stage;
• a brush assembly moveably located below the wafer stage, the brush assembly comprising:
• a plurality of inner protruding portions arranged around a rotation axis;
• and
• a plurality of outer protruding portions arranged around the rotation axis and surrounding the inner protruding portions, wherein a distance between two adjacent outer protruding portions is greater than a distance between two adjacent inner protruding portions;
• a controller initiating a relative motion between the brush assembly and the wafer stage;
• and
• a shaft connected to the brush assembly, wherein the shaft is configured to rotate the brush assembly.