Back to results
US 2024/0177930 A1Published application
Dielectric slurry composition and multilayer electronic component using same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Gyun KWON, So Hyeon HONG, Eung Seok LEE
Life of this patent
Estimating the term…
Abstract
A dielectric slurry composition according to an embodiment of the present disclosure includes: a first solution including a hydrophobic solvent and dielectric particles; and a second solution containing a hydrophilic solvent, a hydrophilic dispersant, and a hydrophilic binder, wherein at least a portion of the first solution has an emulsion structure in the second solution.
Claims22
A dielectric slurry composition comprising:
- a first solution including a hydrophobic solvent and dielectric particles;
- and
- a second solution including a hydrophilic solvent, a hydrophilic dispersant, and a hydrophilic binder,
- wherein at least a portion of the first solution has an emulsion structure in the second solution.
1 more element
A method of producing a multilayer electronic component, the method comprising:
- forming an internal electrode pattern;
- and
- inkjet-printing a dielectric slurry composition on the internal electrode pattern,
- wherein the dielectric slurry composition includes:
- a first solution including a hydrophobic solvent and dielectric particles, and
- a second solution including a hydrophilic solvent, a hydrophilic dispersant and a hydrophilic binder, and
- at least a portion of the first solution has an emulsion structure in the second solution.
4 more elements
Dependencies are inferred from the claim text.