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US 2024/0177911 A1Published application
Photosensitive conductive paste, method for producing multilayer electronic component, and multilayer electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorKenta KONDO
Life of this patent
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Abstract
A photosensitive conductive paste includes a conductive powder, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, a dispersant, and a solvent. The conductive powder is covered with a glass having a glass softening point (Ts) of 800° C. or lower.
Claims16
A photosensitive conductive paste comprising:
- a conductive powder;
- an alkali-soluble polymer;
- a photosensitive monomer;
- a photopolymerization initiator;
- a dispersant;
- and
- a solvent,
- wherein the conductive powder is covered with a glass having a glass softening point of 800° C. or lower.
5 more elements
Dependencies are inferred from the claim text.