Semiconductor memory device and operation method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsByoungkon JO, Gyesik OH, Wangyong IM, Duk Sung KIM, Jangseok CHOI
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AssigneeSamsung Electronics Co., Ltd.
InventorsByoungkon JO, Gyesik OH, Wangyong IM, Duk Sung KIM, Jangseok CHOI
Estimating the term…
A semiconductor memory device, includes, a cell array including a plurality of memory banks, a command decoder configured to decode a read/write command, a read command, and a write command that are input from outside of the semiconductor memory devide, an address decoder receiving a read address and a write address, an input receiver configured to transmit write data input through a write data pad to a global input/output driver of a memory bank corresponding to the write address, and an output driver configured to transmit read data output from an input/output sense amplifier of a memory bank corresponding to the read address to a read data pad, wherein the write data is input via the write data pad in a single data rate method and transmitted to the global input/output driver without deserialization processing, and the read data is transmitted from the input/output sense amplifier to the read data pad without serialization processing. In some embodiments, the semiconductor memory device is electrically and physically coupled to a central processing unit by hybrid copper bonding.
A semiconductor memory device comprising:
A method of operating a semiconductor memory device connected to an external device through hybrid copper bonding, the method comprising:
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.