Print check repeater defect detection

A non-transitory computer-readable medium, storing program instructions executed on a computer system for performing a computer-implemented method for detecting defects on a reticle, wherein the computer-implemented method comprises:

• acquiring images generated for a wafer by an inspection subsystem, wherein a reticle is used to print patterned areas on the wafer in a lithography process, and wherein the patterned areas comprise first patterned areas corresponding to the same area on the reticle and printed in different rows on the wafer;
• generating different stacked difference images for multiple instances of the first patterned areas in the different rows based on the images generated for the first patterned areas in the different rows by the inspection subsystem;
• detecting defect candidates in the multiple instances of the first patterned areas on the wafer by applying a defect detection method to the different stacked difference images, wherein the defect detection method determines that a defect candidate is present at a location in each of the multiple instances of the first patterned areas only when the defect detection method detects the defect candidate at the location in the different stacked difference images;
• and
• identifying defects on the reticle based on the detected defect candidates, wherein said acquiring, generating, detecting, and identifying are performed by the computer system coupled to the inspection subsystem.

A computer-implemented method for detecting defects on a reticle, comprising:

• acquiring images generated for a wafer by an inspection subsystem, wherein a reticle is used to print patterned areas on the wafer in a lithography process, and wherein the patterned areas comprise first patterned areas corresponding to the same area on the reticle and printed in different rows on the wafer;
• generating different stacked difference images for multiple instances of the first patterned areas in the different rows based on the images generated for the first patterned areas in the different rows by the inspection subsystem;
• detecting defect candidates in the multiple instances of the first patterned areas on the wafer by applying a defect detection method to the different stacked difference images, wherein the defect detection method determines that a defect candidate is present at a location in each of the multiple instances of the first patterned areas only when the defect detection method detects the defect candidate at the location in the different stacked difference images;
• and
• identifying defects on the reticle based on the detected defect candidates, wherein said acquiring, generating, detecting, and identifying are performed by a computer system coupled to the inspection subsystem.