Photonic integrated circuit packages including substrates with glass cores

A photonic assembly, comprising:

• a substrate, including:
• a core having a first surface, an opposing second surface, and a lateral surface substantially perpendicular to the first and second surfaces, wherein a material of the core includes glass;
• and
• dielectric with conductive traces on a portion of the second surface of the core;
• a photonic integrated circuit (PIC) and an integrated circuit (IC) electrically coupled to the conductive traces of the dielectric at the second surface of the core;
• a first optical component between to the PIC and the second surface of the core, wherein the first optical component is coupled to the PIC and the second surface of the core by optical glue or by fusion bonding;
• and
• a second optical component at the lateral surface of the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component and the core.

A photonic assembly, comprising:

• a substrate, including:
• a core having a surface, wherein a material of the core includes glass;
• and
• a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways;
• a plurality of photonic integrated circuits (PICs) electrically coupled to the conductive pathways in the dielectric material;
• a plurality of first optical components, respective ones of the plurality of first optical components between respective ones of the plurality of PICs and the surface of the core, wherein the plurality of first optical components are coupled to the surface of the core by optical glue or by fusion bonding;
• and
• a plurality of second optical components coupled to the core, wherein respective ones of the plurality of second optical components are optically coupled to respective ones of the plurality of PICs by optical pathways through the core and the respective ones of the plurality of first optical components.