Substrate inspection apparatus and substrate inspection method

A substrate inspection method, the method comprising:

• providing a substrate on a substrate stage, the substrate having a plurality of internal wires and a plurality of connection wires, the plurality of internal wires respectively provided between a plurality of insulating layers stacked on one another, the plurality of connection wires respectively extending from the plurality of the internal wires and exposed to an upper surface of the substrate;
• modeling an electric circuit having capacitance values of the plurality of internal wires to generate a circuit model;
• applying AC power to the substrate stage to obtain measured capacitance values of the plurality of internal wires through currents that are obtained from the connection wires;
• applying DC power to the substrate stage to obtain measured resistance values of the plurality of internal wires through voltages that are obtained from the connection wires;
• calculating impedance values of the plurality of internal wires through the measured capacitance values and the measured resistance values;
• and
• determining reliability of the impedance values through the circuit model.

A method of substrate inspection, the method comprising:

• providing a substrate on a substrate stage, the substrate having a plurality of internal wires, a plurality of connection wires and a through channel, the plurality of internal wires respectively provided between a plurality of insulating layers stacked on one another, the plurality of connection wires respectively extending from the plurality of the internal wires and exposed to an upper surface of the substrate, a through channel penetrating at least a portion of the plurality of insulating layers;
• modeling an electric circuit of the plurality of internal wires in the substrate to generate a circuit model;
• applying AC power to the substrate stage to obtain measured capacitance values of the plurality of internal wires through currents that are obtained from the connection wires;
• applying DC power to the substrate stage to obtain measured resistance values of the plurality of internal wires through voltages that are obtained from the connection wires;
• calculating impedance values of the plurality of internal wires through the measured capacitance values and the measured resistance values;
• and
• comparing the impedance values and the circuit model to determine reliability of the substrate, wherein:
• modeling an electric circuit includes:
• calculating a basic capacitance value between the plurality of internal wires provided adjacent to each other;
• calculating first theoretical capacitance values of the plurality of internal wires according to a height;
• and
• calculating second theoretical capacitance values between the through channel and the plurality of internal wires.