Wafer defect inspection apparatus

A wafer defect inspection apparatus, adapted for inspecting a sample to be tested, comprising:

• a carrier base adapted for carrying the sample to be tested;
• a light source module, disposed corresponding to the carrier base, comprising:
• an illuminating unit, configured to emit an inspection light ray;
• and
• a pellicle mirror, comprising a reflective surface, wherein the reflective surface faces the illuminating unit and the carrier base, and the reflective surface is adapted for reflecting the inspection light ray to the sample to be tested, so that a reflective light ray formed by reflecting the inspection light ray reflected by the sample to be tested passes through the pellicle mirror;
• at least one beam splitter, disposed on one side of the pellicle mirror opposite to the carrier base and configured to receive and split the reflective light ray passing through the pellicle mirror into a plurality of splitting light rays;
• a plurality of filters, respectively disposed on light pathways of the splitting light rays, wherein the filters are configured to be passed through by different bands corresponding to the splitting light rays;
• and
• a plurality of image sensors, disposed on the light pathways of the splitting light rays and respectively located on one side of one of the filters opposite to the beam splitter, wherein each of the image sensors receives one of the splitting light rays to generate an imaging frame, and two corresponding positions in any two of the imaging frames have two different contrast ratios.