Field device
AssigneeVEGA Grieshaber KG
InventorsJürgen Haas, Thomas IIg, Tobias Bader
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AssigneeVEGA Grieshaber KG
InventorsJürgen Haas, Thomas IIg, Tobias Bader
Estimating the term…
A field device includes a housing with a first end distant from a process and a second end close to the process, an electronic system arranged at the first end, and a process connection and a sensor arranged at the second end. The field device defines a first heat conduction path (A), which extends from the second end close to the process to an emitting region, and at least one second heat conduction path (B, B′), which extends from the second end close to the process to the electronic system, wherein the length of the first heat conduction path (A) is shorter than the length of the second heat conduction path (B, B′), and the heat conduction paths (A, B, B′) are arranged so that the thermal resistance of the first heat conduction path (A) is lower than the thermal resistance of the second heat conduction path (B, B′).
A field device with a housing-(14), wherein the housing (14) has a first end-(16) distant from the process and a second end (18) close to the process, and wherein in the housing(14) at the first end (16) distant from the process an electronic system(20) is arranged, and wherein in the housing(14) at the second end(18) close to the process a sensor element(22) is arranged, and wherein the housing(14) has at the second end-(18) close to the process a process connection (34), wherein characterized in that the field device(10) has a first heat conduction path (A), which extends from the second end(18) close to the process to an emitting region(44), and at least one second heat conduction path-(B, B′), which extends from the second end-(18) close to the process to the electronic system(20), wherein the length of the first heat conduction path (A) is smaller than the length of the second heat conduction path(B, B′), and wherein the heat conduction paths(A, B, B′) are designed such that the thermal resistance of the first heat conduction path(A) is lower than the thermal resistance of the second heat conduction path (B, B′).
Dependencies are inferred from the claim text.