Fluid heat exchange systems

A heat-exchange device for cooling an electronic component, the heat-exchange device comprising:

• a housing having an inlet port and an outlet port, the housing defining a pump volute;
• an impeller positioned within the pump volute and configured to rotate therein to urge a coolant to flow through the heat-exchange device;
• a heat-spreader plate having a plurality of fins defining a corresponding plurality of microchannels, wherein the heat-spreader plate is mechanically coupled with the housing, the housing and the heat-spreader plate defining an interior region of the heat-exchange device;
• an insert that defines a pair of opposed flat surfaces overtop the fins to define a flow boundary of the microchannels opposite the heat-spreader plate, wherein the insert defines an elongate slot oriented transversely overtop the plurality of microchannels at a position between the opposed flat surfaces;
• wherein the insert occupies a portion of the interior region of the heat-exchange device and leaves a pair of opposed portions of the interior region overtop the fins unoccupied;
• wherein a portion of the insert defines a raised seal member extending to the housing between the elongate slot and the unoccupied opposed portions of the interior region to prevent a liquid from bypassing the microchannels as the liquid flows between the inlet port and the outlet port, wherein the insert is a continuous, monolithic member defining the pair of flat surfaces and the raised seal member;
• wherein the insert further defines a plurality of raised, spaced-apart members and a recess between the members, wherein the housing defines a recess corresponding to each of the raised, spaced-apart members of the insert, wherein the insert matingly engages with the housing so the raised, spaced-apart members of the insert are positioned in the corresponding recesses of the housing and a portion of the housing is positioned in the recess between the members of the insert.