Wafer back surface cleaning device

Abstract

A wafer back surface cleaning device preventing foreign matter from re-adhering to front and back surfaces of a wafer W during and after cleaning. A hand H1 receives a wafer W that has been cleaned at a cleaning position and conveys the wafer W to a subsequent process, a hand H2 that conveys the wafer W before grinding to the cleaning position and transfers the wafer W that has been cleaned to hand H1 with a front surface of the wafer directed upward A cleaning pad 13 and a cleaning water supply nozzle 14 supplies cleaning water to the cleaning pad 13 and discharges the cleaning water to a back surface of the wafer W, at the cleaning position, the hand H2 brings the back surface of the wafer W conveyed to the cleaning position into contact with the cleaning pad 13 to perform scrub cleaning on the back surface of the wafer, and receives the cleaning water from the cleaning water supply nozzle 14 on the back surface of the wafer after scrub cleaning to perform rinse cleaning, and then transfers the wafer W to the hand H1.

Dependencies are inferred from the claim text.