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US 2024/0165726 A1Published application
Composite Soldering, De-Soldering Station and System
AssigneeHakko Corporation
InventorsKenji Matsuzaki, Hitoshi Takeuchi, Kenta Nakamura
Life of this patent
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Abstract
A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.
Claims11
A system for use in solder operations comprising:
- a control station;
- at least one soldering cartridge including a heater and a temperature sensor in a tip of said soldering cartridge, the temperature of said soldering cartridge controlled by said control station from feedback of said temperature sensor;
- and
- a temperature measurement device physically separated from said control station and said soldering cartridge wherein a comparison of the temperature measurement device temperature measurement and a temperature measured by said temperature sensor in said tip of said cartridge determines whether the temperature of the tip has been successfully calibrated, and wherein the comparison result of either PASS or FAIL is stored in a memory as the calibration result.
1 more element
The system for use in solder operations of claim 19, wherein said PASS/FAIL calibration result and a calculated offset value is recorded to a memory of said control station.
Dependencies are inferred from the claim text.