Electronic chip with ubm-type metallization

An electronic chip including a semiconductor substrate and, on the side of one face of the substrate, a metal pad (13) intended to receive a soldering material, the pad including, in order from said face of the substrate, a first metal layer on, and in contact with, said face of the substrate, an electrically conductive barrier layer on, and in contact with, said first metal layer, and a second metal layer on, and in contact with, said electrically conductive barrier layer, wherein the sidewalls of the first metal layer, of the electrically conductive barrier layer, and of the second metal layer are vertically aligned, and wherein an electrically insulating barrier layer is disposed on, and in contact with, the sidewall of the first metal layer around the entire periphery of the metal pad.