Lead frame and manufacturing method of lead frame insert molded article
AssigneeOMRON Corporation
InventorsHiroyuki FUJITA, Kenji SHINOHARA, Hiroto YONEHARA
Life of this patent
Estimating the term…
Loading patent…
AssigneeOMRON Corporation
InventorsHiroyuki FUJITA, Kenji SHINOHARA, Hiroto YONEHARA
Estimating the term…
A lead frame 10 includes first and second frames 13, 14 and a fixed contact piece 15. The fixed contact piece 15 is integrally formed with the first frame via a conductive connection part 16. The first frame and the fixed contact piece 15 and the second frame have installation parts 13a, 14a, 14b, 15b to which resistance elements are able to install. The first frame 13 and the fixed contact piece have installation parts 13b, 15a to which resistance elements are able to install. Electrical circuits of different types are formed through combinations of whether the resistance elements are installed to the respective installation parts and whether the conductive connection part 16 is cut off.
A lead frame, forming an electrical circuit of a switch device and comprising:
A manufacturing method of a lead frame insert molded article in which a lead frame is integrated with a resin case having a bottomed cylindrical shape through insert molding, so that a first terminal part and a second terminal part protrude in a cylinder axial direction from a bottom part of the resin case, the lead frame comprising:
Dependencies are inferred from the claim text.