Conversion pipe arrangement, substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor device

Abstract

There is provided a technique that includes: a first connector including a first opening including two longitudinally extending parallel sides and configured to provide a detachable connection to an opening of a first counterpart; and a second connector including a substantially circular second opening and configured to be connectable to an opening of a second counterpart; and a pipe including an internal space formed in a shape of a polyhedron and configured to allow fluid communication between the first opening and the second opening.

Dependencies are inferred from the claim text.