Photocurable resin composition and three-dimensional stereolithography product

A photocurable resin composition, comprising:

• a reactive compound;
• and a photopolymerization initiator, wherein
• the reactive compound includes a reactive monomer and a reactive oligomer,
• a mass ratio between the reactive monomer and the reactive oligomer (=reactive monomer/reactive oligomer) is 20/80 to 70/30,
• a cured product of the photocurable resin composition has two or more glass transition points including a TgA and a TgB,
• the TgA being less than 25° C., and
• the TgB being 25° C. or more,
• the reactive compound includes a first compound and a second compound,
• a glass transition point Tg1 of a cured product of the first compound is 10° C. or less,
• a glass transition point Tg2 of a cured product of the second compound is 50° C. or more,
• the first compound includes at least a first oligomer as the reactive oligomer,
• a mass ratio between the first compound and the second compound (=first compound/second compound) is 20/80 to 85/15,
• an elongation at break in accordance with ASTM D638 of the cured product of the photocurable resin composition is 130% or more, and
• a breaking strength in accordance with ASTM D638 of the cured product of the photocurable resin composition is 3 MPa or more.