Machine-learning device, control device, and machine-learning method

A machine learning device for performing machine learning of machining conditions including at least laser scan wait time for controlling machining of a workpiece in a laser machine, the machine learning device comprising:

• an action output unit configured to select a machining condition as an action from among a plurality of machining conditions and output the action to the laser machine;
• a state acquisition unit configured to acquire, as state information, image data generated through imaging of a machining state of a workpiece machined according to the action;
• a reward computing unit configured to compute a reward based at least on the laser scan wait time and a machining accuracy of the machining state computed based on the state information acquired by the state acquisition unit;
• and
• a learning unit configured to perform the machine learning of the machining conditions based on the state information acquired by the state acquisition unit and the reward computed by the reward computing unit.