Laser-formed interconnects for redundant devices

A processable integrated circuit, comprising:

• an integrated circuit substrate;
• a circuit disposed in, on, or over the integrated circuit substrate;
• an electrical connector electrically connected to the circuit;
• and
• an opening structure electrically connected in serial between the electrical connector and the circuit, wherein the opening structure is constructed and arranged to form an electrical open when subjected to laser radiation.

A parallel redundant system, comprising:

• a substrate;
• a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit;
• a second circuit disposed over the substrate;
• a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor;
• a dielectric layer disposed at least partially between the first layer and the second layer;
• and
• a laser weld electrically connecting the first conductor to the second conductor through the dielectric layer.