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US 2024/0006364 A1Published application
Semiconductor device
AssigneeRohm Co., Ltd.
InventorKengo OHMORI
Life of this patent
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Abstract
A semiconductor device includes a conductor, a semiconductor element, and a sealing resin. The conductor has an obverse surface facing in the thickness direction. The semiconductor element includes an element body and a plurality of electrodes connected to the element body and bonded to the obverse surface. The sealing resin covers the semiconductor element. The sealing resin has a top surface facing the same side as the obverse surface in the thickness direction, and an opening penetrating the top surface in the thickness direction. The element body is exposed through the opening.
Claims17
A semiconductor device comprising:
- a conductor having an obverse surface facing in a thickness direction;
- a semiconductor element including an element body and a plurality of electrodes, the plurality of electrodes being connected to the element body and bonded to the obverse surface;
- and
- a sealing resin covering the semiconductor element,
- wherein the sealing resin has a top surface and an opening, the top surface facing a same side as the obverse surface in the thickness direction, the opening penetrating the top surface in the thickness direction, and
- the element body is exposed through the opening.
3 more elements
Dependencies are inferred from the claim text.