Semiconductor device and method of manufacturing the same

A method of manufacturing a semiconductor device, comprising steps of:

• (a) forming a groove portions extending over a corner portion of each of a plurality of chip regions by partially removing a back surface of a semiconductor wafer, the semiconductor wafer having the plurality of chip regions and a scribe region located between the plurality of chip regions adjacent to each other;
• and
• (b) obtaining a semiconductor chip by cutting the semiconductor wafer along the scribe region,
• wherein a planar shape of the semiconductor ship obtained by the step of (b) is a quadrangular shape,
• wherein, in plan view, a plurality of thin portions is formed at a plurality of corner portions of the semiconductor chip, respectively,
• wherein one of the plurality of thin portions corresponds to a part of the groove portion formed in the step of (a),
• wherein the plurality of thin portions respectively formed at the plurality of corner portions of the semiconductor chip is spaced apart from each other, and
• wherein a thickness of each of the plurality of thin portions is smaller than a thickness of the semiconductor chip other than the plurality of the thin portions.