Ultra dense processors with embedded microfluidic cooling
AssigneeMicrosoft Technology Licensing, LLC
InventorsBharath RAMAKRISHNAN, Husam Atallah ALISSA, Christian L. BELADY, Sean Michael JAMES, Vaidehi ORUGANTI
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Abstract
A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.
Claims20
A processing unit comprising:
- a first die;
- a second die;
- a microfluidic volume between the first die and the second die;
- and
- a heat transfer structure coupling the first die to the second die and located in the microfluidic volume.
A computing system comprising:
- a first wafer including:
- a first die,
- a second die,
- a first microfluidic volume between the first die and the second die, and
- a first plurality of heat transfer structures coupling the first die to the second die and located in the first microfluidic volume;
- a second wafer including:
- a third die,
- a fourth die,
- a second microfluidic volume between the third die and the fourth die, and
- a second plurality of heat transfer structures coupling the third die to the fourth die and located in the second microfluidic volume;
- and
- a manifold configured to flow an electrochemical fluid through the first microfluidic volume and the second microfluidic volume, the electrochemical fluid configured to provide electrical power to the first die and second die and to receive heat from the first plurality of heat transfer structures and the second plurality of heat transfer structures.
A method of providing power and cooling to a stacked-die processor, the method comprising:
- providing an electrochemical fluid to a microfluidic volume of the stacked-die processor;
- generating electrical power at the stacked-die processor with the electrochemical fluid;
- receiving heat from the stacked-die processor with the electrochemical fluid in the microfluidic volume;
- and
- exhausting the heat from the electrochemical fluid at a heat exchanger.
Dependencies are inferred from the claim text.