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US 2023/0422407 A1Published application
Printed wiring board
AssigneeSumitomo Electric Industries, Ltd.
InventorsKenji TAKAHASHI, Shoichiro SAKAI, Kou NOGUCHI
Life of this patent
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Abstract
A printed wiring board includes: a base film having a main surface; a wiring disposed on the main surface; a first plating lead connected to a first position of the wiring; and a second plating lead connected to a second position of the wiring. A cross sectional area of the wiring at a third position of the wiring is 95% or more of a cross sectional area of the wiring at the first position, the third position being an intermediate position between the first position and the second position.
Claims5
A printed wiring board comprising:
- a base film having a main surface;
- a wiring disposed on the main surface;
- a first plating lead connected to a first position of the wiring;
- and
- a second plating lead connected to a second position of the wiring, wherein
- a cross sectional area of the wiring at a third position of the wiring is 95% or more of a cross sectional area of the wiring at the first position, the third position being an intermediate position between the first position and the second position.
3 more elements
Dependencies are inferred from the claim text.