US 2023/0421129 A1Published application

Acoustic wave device

AssigneeMurata Manufacturing Co., Ltd.

InventorsTetsuya KIMURA, Kazunori INOUE, Katsumi SUZUKI

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Abstract

An acoustic wave device includes a piezoelectric layer including first and second main surfaces opposed to each other, a functional electrode on at least one of the first and second main surfaces, and a support substrate on a second main surface side of the piezoelectric layer. A hollow portion is between the support substrate and the piezoelectric layer. The functional electrode at least partially overlaps the hollow portion when viewed in a laminating direction in which the support substrate and the piezoelectric layer are laminated. A through-hole extends through the piezoelectric layer to the hollow portion. A raised portion extending along a depth direction of the through-hole is on an inner wall of the through-hole.

Claims20

Dependent claims

An acoustic wave device comprising:

a piezoelectric layer including a first main surface and a second main surface that are opposed to each other;
a functional electrode on at least one of the first main surface and the second main surface of the piezoelectric layer;
and
a support substrate on a second main surface side of the piezoelectric layer;
wherein
a hollow portion is between the support substrate and the piezoelectric layer;
the functional electrode at least partially overlaps the hollow portion when viewed in a laminating direction in which the support substrate and the piezoelectric layer are laminated;
a through-hole extends through the piezoelectric layer and reaches the hollow portion;
and
a raised portion extending along a depth direction of the through-hole is on an inner wall of the through-hole.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/367,516Filed 13 Sep 2023
Priority: 31 Mar 2021
Published: 28 Dec 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

H03H 9/13
Driving means, e.g. electrodes, coils: for networks consisting of piezoelectric or electrostrictive materials
H03H 3/02
For the manufacture of electromechanical resonators or networks: for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/02015
Of bulk acoustic wave devices: characteristics of piezoelectric layers, e.g. cutting angles
H03H 9/02157
Of bulk acoustic wave devices: dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness

Family

Application63/168,311Us provisional application · filed 31 Mar 2021
Application18/367,516Continuation
US 2023/0421129 A1This patent

From the US filing history. Foreign family members aren’t listed.

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