Power mosfet device having improved safe-operating area and on resistance, manufacturing process thereof and operating method thereof
AssigneeSTMicroelectronics S.r.l.
InventorsAngelo MAGRI', Stefania FORTUNA
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AssigneeSTMicroelectronics S.r.l.
InventorsAngelo MAGRI', Stefania FORTUNA
Estimating the term…
A power MOSFET device includes an active area accommodating a first body region and a second body region having a first and, respectively, a second conductivity value. The second value is higher than the first value. A first channel region is disposed in the first body region between a first source region and a drain region, and the first channel region has and having a first channel length. A second channel region is disposed in the second body region between a second source region and the drain region, and the second channel region has and having a second channel length smaller than the first channel length. A first device portion, having a first threshold voltage, includes the first channel region, and a second device portion, having a second threshold voltage higher than the first threshold voltage, includes the second channel region.
A process for manufacturing a power MOSFET device, comprising:
A method for operating a power MOSFET device, the method comprising:
A method, comprising:
Dependencies are inferred from the claim text.