Modular power transistor component assemblies with flip chip interconnections

A transistor device package, comprising:

• a transistor die comprising a gate terminal, a drain terminal, and a source terminal;
• and
• a passive component assembly comprising one or more passive electrical components electrically coupled to the gate terminal, the drain terminal, and/or the source terminal,
• wherein the transistor die is on a surface of the passive component assembly, and the surface of the passive component assembly comprises a support structure that provides a cavity extending around the transistor die.

A transistor device package, comprising:

• an active component assembly comprising a transistor die having a gate terminal, a drain terminal, and a source terminal;
• a passive component assembly including the active component assembly on a surface thereof and comprising one or more passive electrical components electrically coupled to the gate terminal, the drain terminal, and/or the source terminal;
• a mold structure on the one or more passive electrical components;
• and
• a frame structure providing a cavity that extends around the transistor die.

A passive component assembly, comprising:

• one or more passive electrical components on a surface of an interconnect structure, wherein the interconnect structure is configured to electrically couple the one or more passive electrical components to a gate terminal, drain terminal, and/or source terminal of a transistor die;
• a mold structure on the one or more passive electrical components on the surface of the interconnect structure;
• and
• one or more conductive pads that are electrically coupled to the one or more passive electrical components and are exposed by the mold structure.