Electronic devices
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWei-Cheng LIN, Hung-Yi LIN, Cheng-Yuan KUNG, Hsu-Chiang SHIH, Cheng-Yu HO
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AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWei-Cheng LIN, Hung-Yi LIN, Cheng-Yuan KUNG, Hsu-Chiang SHIH, Cheng-Yu HO
Estimating the term…
The present disclosure provides an electronic device. The electronic device includes a first electronic component and a second electronic component. The first electronic component is configured to receive a radio frequency (RF) signal and amplify a power of the RF signal. The second electronic component is disposed under the first electronic component. The second electronic component includes an interconnection structure passing through the second electronic component. The interconnection structure is configured to provide a path for a transmission of the RF signal.
An electronic device, comprising:
An electronic device, comprising:
An electronic device, comprising:
Dependencies are inferred from the claim text.