Semiconductor package

A semiconductor package, comprising:

• a semiconductor die having a first surface, a second surface opposing the first surface, a first contact pad on the first surface and a second contact pad on the second surface;
• a die pad and at least one lead spaced apart from the die pad, wherein the first contact pad of the semiconductor die is mounted on the die pad and the second contact pad is electrically connected to the at least one lead by a connector;
• a mold compound covering the semiconductor die, the connector, and an upper surface of the die pad and of the at least one lead;
• and
• a metallic member inductively coupled to the connector and electrically resistively insulated from the connector,
• wherein the metallic member comprises a web portion arranged above the second surface of the semiconductor die and at least one peripheral rim portion that extends from the web portion in a direction towards the first surface of the semiconductor die.