Chip package and manufacturing method thereof

A manufacturing method of a chip package, comprising:

• forming a first antenna layer on a top surface of a first light-transmissive sheet;
• bonding a second light-transmissive sheet to the top surface of the first light-transmissive sheet such that the first antenna layer is disposed between the first light-transmissive sheet and the second light-transmissive sheet;
• bonding the first light-transmissive sheet to a top surface of a semiconductor substrate, wherein the first light-transmissive sheet is located between the second light-transmissive sheet and the semiconductor substrate, and the top surface of the first light-transmissive sheet faces away from the semiconductor substrate, the top surface of semiconductor substrate is lower than the entire first light-transmissive sheet, and the top surface of the first light-transmissive sheet is lower than the entire second light-transmissive sheet;
• performing a cutting process such that the first light-transmissive sheet has an inclined sidewall adjacent to the top surface of the first light-transmissive sheet, and an end of the first antenna layer is exposed;
• and
• forming a redistribution layer on the inclined sidewall of the first light-transmissive sheet such that the redistribution layer is in contact with the end of the first antenna layer.