Semiconductor packaging emi shielding structure and manufacturing method of the same

A method for manufacturing a semiconductor packaging structure, comprising:

• providing a base layer, comprising a first base layer portion, a second base layer portion and a third base layer portion respectively corresponding to a first packaging body area, a second packaging body area and a cutting channel area;
• disposing a first die and a second die respectively on the first base layer portion and the second base layer portion;
• forming a bonding wire, wherein a first terminal of the bonding wire overlaps the first base layer portion, a second terminal of the bonding wire overlaps the second base layer portion, and the bonding wire crosses the third base layer portion, in a top view;
• filing a molding compound over the base layer and surrounding the first die and the bonding wire;
• cutting the molding compound and the base layer to obtain a first portion structure corresponding to the first packaging body area and a second portion structure corresponding to the second packaging body area, wherein the bonding wire is exposed from the side surface of the first portion structure and the side surface of the second portion;
• and
• forming a shielding layer at the top surface and the side surface of the first portion structure to cover the top surface and the side surface the molding compound.