US 2023/0420384 A1 · SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE

Abstract

Embodiments herein relate to systems, apparatuses, or processes directed to a stiffener for a surface of a semiconductor package, where the stiffener includes slots that allow a gasket to go over the stiffener to electrically couple with a ground or a VSS of the semiconductor package. In embodiments, the gasket may include a material that blocks or absorbs EMI or RFI. Other embodiments may be described and/or claimed.

Claims25

Dependent claims

An apparatus comprising:

a stiffener for a semiconductor substrate, the stiffener with a first side and a second side opposite the first side;
and
a plurality of slots in the stiffener, each of the plurality of slots extending from the first side of the stiffener to the second side of the stiffener.

Dependencies are inferred from the claim text.

Facts

Application

17/848,639Filed 24 Jun 2022

Published

28 Dec 2023

Term ends

Not estimatedThe source records don’t support an estimate.

Classification12 codes

H10W 42/20
Arrangements for protection of devices: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
H10W 40/22
Arrangements for cooling: characterised by their shape, e.g. having conical or cylindrical projections
H10W 42/121
Arrangements for protection of devices: protecting against mechanical damage
H10W 44/20
Electrical arrangements for controlling or matching impedance: at high-frequency [HF] or radio frequency [RF]

Slotted stiffener for a package substrate

Life of this patent

Slotted stiffener for a package substrate

Life of this patent

Abstract

Claims25