Semiconductor Device and Method of Double Shielding

A method of making a semiconductor device, comprising:

• providing a substrate;
• disposing a first electrical component and second electrical component over the substrate;
• disposing a conductive pillar over the substrate between the first electrical component and second electrical component;
• forming a first shielding layer over the first electrical component and conductive pillar;
• and
• forming a second shielding layer over the first electrical component and second electrical component.

A method of making a semiconductor device, comprising:

• providing a substrate;
• disposing an electrical component over the substrate;
• disposing a conductive pillar over the substrate;
• forming a first shielding layer over the electrical component and conductive pillar;
• and
• forming a second shielding layer over the first shielding layer.

A semiconductor device, comprising:

• a substrate;
• an electrical component disposed over the substrate;
• a conductive pillar disposed over the substrate;
• a first shielding layer formed over the electrical component and conductive pillar;
• and
• a second shielding layer formed over the first shielding layer.