Semiconductor package

A semiconductor package comprising:

• a package substrate comprising a first side and an opposite second side;
• a semiconductor chip on the first side of the package substrate;
• a capacitor on the second side of the package substrate, wherein the capacitor has a rectangular shape in plan view;
• an underfill between the capacitor and the package substrate;
• a plurality of connecting terminals on the second side of the package substrate;
• and
• a plurality of metal lines within the package substrate,
• wherein the plurality of metal lines are in adjacent, spaced apart relationship and are between a first surface of the capacitor and the plurality of connecting terminals,
• wherein each of the plurality of metal lines has an “I” shape in plan view.

A semiconductor package comprising:

• a package substrate comprising a first side and an opposite second side;
• a plurality of pad patterns on the second side of the package substrate;
• a semiconductor chip on the first side of the package substrate;
• a capacitor on the second side of the package substrate, wherein the capacitor has a rectangular shape in plan view;
• an underfill between the capacitor and the package substrate;
• a plurality of connecting terminals on the second side of the package substrate, wherein each of the plurality of pad patterns is connected to a respective one of the plurality of connecting terminals;
• and
• a metal line within a trench in the package substrate, wherein the trench extends in a first direction, and wherein the metal line comprises a metal film and a metal oxide film on the metal film,
• wherein the trench is between a first surface of the capacitor and the plurality of connecting terminals,
• wherein the metal line comprises a first sub-line and a second sub-line spaced apart from each other in a second direction transverse to the first direction,
• wherein the underfill overlaps at least a part of the first sub-line, and does not overlap the second sub-line,
• wherein a bottom surface of the metal line and the second side of the package substrate are co-planar, and
• wherein a thickness of each of the plurality of pad patterns is the same as a thickness of the metal line.