Sinx adhesion promoter with adhesion hole features in packaging substrate for reliability performance enhancement

A method of forming an electronic package, comprising:

• forming a trace and a pad over a first layer;
• forming a mask feature over the first layer;
• disposing a liner over the trace, the pad, and the first layer, wherein the mask feature blocks the deposition of the liner over a portion of the first layer;
• removing the mask feature;
• and
• disposing a second layer over the first layer, the trace, and the pad.

A method of forming an electronic package, comprising:

• forming a trace and a pad over a first layer;
• disposing a liner over the trace, the pad, and the first layer;
• forming a patterned mask layer over the trace, the pad, and the first layer, wherein the patterned mask layer includes an opening to expose a region of the liner adjacent to the trace;
• removing the liner in the opening;
• and
• disposing a second layer over the first layer, the trace, the pad, and the liner.

An electronic system, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises:
• a first layer;
• a trace over the first layer;
• a liner over the first layer and the trace, wherein a hole adjacent to the trace is provided through the liner;
• and
• a second layer over the first layer, the trace, and the liner;
• and
• a die coupled to the package substrate.