Seal for microelectronic assembly
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsRajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed
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Abstract
Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.
Claims29
A bonded structure, comprising:
- a first microelectronic component comprising a first surface and a second surface opposite the first surface;
- a second microelectronic component comprising a third surface directly bonded to the first surface without an intervening adhesive to form a bond joint;
- and
- a seal disposed over the bond joint, the seal comprising a channel extending continuously around an interior region of the bonded structure, the channel having sidewalls at least partially covered with metal, the sidewalls extending from the second surface into the first microelectronic component.
A bonded structure, comprising:
- a first microelectronic component comprising a first surface and a second surface opposite the first surface;
- a second microelectronic component comprising a third surface directly bonded to the first surface without an intervening adhesive to form a bond joint;
- and
- a seal comprising a channel extending at least partially around an interior region of the bonded structure, the channel extending from the second surface through the first electronic component and across the bond joint into at least a portion of the second microelectronic component, a metallic material disposed in the channel.
A bonded structure, comprising:
- a first microelectronic component comprising a first surface, a second surface opposite the first surface, and a side edge extending from the first surface to the second surface;
- a second microelectronic component comprising a third surface directly bonded to the first surface without an intervening adhesive to form a bond joint;
- and
- a seal disposed over the bond joint, the seal comprising a channel extending continuously around an interior region of the bonded structure, the channel having sidewalls extending from the second surface into the first microelectronic component,
- wherein, between the side edge and the interior region as viewed in a side cross-section of the bonded structure, metal is present at every elevation between the bond joint and the second surface, such that fluid cannot travel in a straight path from the side edge to the interior region without encountering metal.
A method for forming a bonded structure, the bonded structure comprising:
- directly bonding a first surface of a first microelectronic component to a second microelectronic component;
- after directly bonding, thinning the first microelectronic component from a second surface opposite the first surface;
- providing a channel in the thinned first microelectronic component extending from the second surface into the thinned first microelectronic component, the channel extending at least partially around an interior region of the bonded structure;
- and
- providing a metallic material in the channel.
Dependencies are inferred from the claim text.