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US 2023/0420227 A1Published application
Substrate processing apparatus
AssigneeASM IP Holding B.V.
InventorChangMin Lee
Life of this patent
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Abstract
A substrate processing apparatus capable of locally controlling a plasma intensity and improving thin film properties and thickness uniformity includes: a power supply unit, a processing unit electrically connected to the power supply unit, and a substrate support unit below the processing unit, wherein the substrate support unit includes a first ground electrode and a second ground electrode.
Claims21
A substrate processing apparatus comprising:
- a power supply unit;
- a processing unit electrically connected to the power supply unit;
- and
- a substrate support unit below the processing unit,
- wherein the substrate support unit comprises a first ground electrode and a second ground electrode.
2 more elements
Dependencies are inferred from the claim text.