Quantum chip and method for preparing the same
AssigneeTencent Technology (Shenzhen) Company Limited
InventorsDengfeng LI, Wenlong ZHANG, Maochun DAI, Kunliang BU, Sainan HUAI
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AssigneeTencent Technology (Shenzhen) Company Limited
InventorsDengfeng LI, Wenlong ZHANG, Maochun DAI, Kunliang BU, Sainan HUAI
Estimating the term…
This application provides a method for preparing a quantum chip. The method includes the following steps: determining an initial eigenfrequency of a chip substrate; performing, based on a numerical comparison result between the initial eigenfrequency and a quantum operating frequency, pattern etching on a first surface of the chip substrate to obtain a chip substrate with an intact second surface and the first surface with a target pattern, wherein the quantum operating frequency is an operating frequency of a quantum bit of a quantum circuit, the second surface is opposite to the first surface, and the target pattern is a pattern when a difference between the initial eigenfrequency of the chip substrate and the quantum operating frequency is maximum; and etching, on the second surface of the pattern-etched chip substrate, the quantum circuit to form the quantum chip.
A method for preparing a quantum chip, the method comprising:
A quantum chip, wherein a chip substrate of the quantum chip comprises an opposing first surface and second surface;
Dependencies are inferred from the claim text.