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US 2023/0418160 A1Published application
Photosensitive resin composition, protective layer and method for pattern formation
AssigneeAdvanced Echem Materials Company Limited
InventorsKuan-Ming Chen, Chi-Yu Lai
Life of this patent
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Abstract
A photosensitive resin composition, a protective layer, and a method for pattern formation are provided. The photosensitive resin composition includes an alkali-soluble resin (A), a sensitizer (B), an additive (C), and a solvent (D). The additive (C) includes a compound represented by Formula (C-1) as follows. In Formula (C-1), the definitions of R1 to R4 are as defined in the specification.
Claims12
A photosensitive resin composition, comprising:
- an alkali-soluble resin (A);
- a sensitizer (B);
- an additive (C);
- and
- a solvent (D),
- wherein the additive (C) comprises a compound represented by Formula (C-1) as follows:
- wherein R1 represents hydrogen, hydroxyl, an alkyl group having 1 to 15 carbon atoms, a phenyl group, a phenyl group substituted by an aryl group, an acid group, an ester group, an alkylamino group, a halogen atom, a cyano group, or a combination thereof, R2 represents a group represented by Formula (C-2) as follows, and R3 and R4 each represent hydrogen or a group represented by Formula (C-3) as follows,
- wherein R5 represents hydrogen or a methyl group, m represents an integer from 0 to 300, and * represents a bonding position,
- wherein R6 represents hydrogen or a methyl group, n represents an integer from 0 to 300, and * represents a bonding position.
6 more elements
Dependencies are inferred from the claim text.