Template, pattern forming method, and semiconductor device manufacturing method
AssigneeKioxia Corporation
InventorHirotaka TSUDA
Life of this patent
Estimating the term…
Abstract
A template includes a first region having a first face on a side opposite to a main face and a first pattern including a convex-concave portion provided on the first face, and a second region, provided around the first region, having a second face on the side opposite to the main face, a second pattern including a protruding portion protruding from the second face, and an optical layer provided on the second face and the second pattern, wherein the second face is positioned farther to the main surface side than a bottommost face of the irregular portion.
Claims18
A template, comprising:
- a first region having a first face and a first pattern, the first region being on a side opposite to a main face, the first pattern including a convex-concave portion disposed on the first face;
- and
- a second region, disposed around the first region, having a second face and a second pattern, the second face being on the side opposite to the main face,
- the second pattern including a protruding portion protruding from the second face, and an optical layer disposed on the second face and the second pattern, wherein the second face is positioned farther to the main surface side than a bottommost face of the irregular portion.
A pattern formation method in which a template is used, wherein the template comprises:
- a first region having a first face and a first pattern, the first face being on a side opposite to a main face, and the first pattern including a convex-concave portion disposed on the first face;
- and
- a second region, provided around the first region, having a second face, a second pattern and an optical layer, the first face being on the side opposite to the main face, the second pattern including a protruding portion protruding from the second face, and the optical layer disposed on the second face and the second pattern, wherein the second face is positioned farther to the main surface side than a bottommost face of the irregular portion, and
- the pattern formation method comprises:
- forming a coating layer having a first portion and a second portion, the first portion being on a target object and the second portion being on the target object, by applying an imprint material onto the target object, and
- transferring the first pattern to the second portion by pressing the template against the coating layer, bringing the irregular portion into contact with the second portion, bringing the protruding portion into contact with the first portion without bringing the second face into contact with the first portion and the second portion, and curing the second portion after the contact is made.
A semiconductor device manufacturing method in which a template is used, wherein the template comprises:
- a first region having a first face and a first pattern, the first face being on a side opposite to a main face, and the first pattern including a convex-concave portion provided on the first face;
- and
- a second region, disposed around the first region, having a second face, a second pattern and an optical layer, the second face being on the side opposite to the main face, the second pattern including a protruding portion protruding from the second face, the optical layer provided on the second face and the second pattern, wherein the second face is positioned farther to the main surface side than a bottommost face of the irregular portion, and
- the manufacturing method comprising:
- forming a coating layer having a first portion and a second portion, the first portion being on a target object, the second portion being on the target object, by applying an imprint material onto the target object, and
- transferring the first pattern to the second portion by pressing the template against the coating layer, bringing the irregular portion into contact with the second portion, bringing the protruding portion into contact with the first portion without bringing the second face into contact with the first portion and the second portion, and curing the second portion after the contact is made.
Dependencies are inferred from the claim text.