Display assembly using structural adhesive

A method of increasing thermal conduction in an electronic display assembly,

• said method comprising:
• securing a panel forming part of a thermal management substructure for said electronic display assembly;
• robotically depositing a structural adhesive to at least one of an electronic component for operating said electronic display assembly and said panel;
• robotically securing said electronic component directly to a first side of said panel by way of said adhesive;
• robotically securing said thermal management substructure within a housing of said electronic display assembly such that a second side of said panel defines, at least in part, at least a portion of an airflow pathway of said electronic display assembly of which said thermal management substructure forms a part;
• operating said electronic display assembly, including using said electronic component;
• activating a first set of one or more fans of said electronic display assembly to move ambient air through said airflow pathway, including across said second side of said panel to remove heat generated by said electronic component and conducted through said panel;
• and
• activating a second set of one or more fans of said electronic display assembly to move circulating air through a closed loop airflow pathway of said electronic display assembly of which said thermal management substructure forms a part, including across said first side of said panel and said electronic component, wherein said closed loop airflow pathway is fluidly separated from said airflow pathway at least in part by said panel.

A method of increasing thermal conduction in an electronic display assembly,

• said method comprising:
• securing a panel forming part of a thermal management substructure for said electronic display assembly;
• robotically preparing a structural adhesive comprising glass beads of a predetermined size and methyl methacrylate;
• robotically depositing the structural adhesive to at least one of an electronic component for operating said electronic display assembly and said panel;
• robotically securing said electronic component directly to a first side of said panel by way of said adhesive;
• robotically securing said thermal management substructure within a housing of said electronic display assembly such that a second side of said panel defines, at least in part, at least a portion of an airflow pathway of said electronic display assembly of which said thermal management substructure forms a part;
• and
• operating said electronic display assembly, including using said electronic component.