Vapor chamber

A vapor chamber, comprising:

• a first cover, having a thermally conductive protrusion structure configured to be thermally coupled to a heat source;
• and
• a second cover, wherein the second cover and the first cover are joined together to form an air tight space, and the air tight space is configured to accommodate a cooling fluid;
• wherein the second cover has at least one first support protrusion structure, the at least one first support protrusion structure and the thermally conductive protrusion structure protrude in a same direction, and the at least one first support protrusion structure is in physical contact with the first cover.

A vapor chamber, comprising:

• a first cover, having a thermal contact surface configured to be thermally coupled to a heat source;
• and
• a second cover, wherein the second cover and the first cover are joined together to form an air tight space, the air tight space is configured to accommodate a cooling fluid, and the thermal contact surface faces away from the air tight space;
• wherein the first cover has at least one first support protrusion structure, and the at least one first support protrusion structure protrudes from the first cover and is in physical contact with the second cover.