Resin for pressure-sensitive adhesive sheets and pressure-sensitive adhesive sheet
AssigneeNitto Denko Corporation
InventorKeisuke HIRANO
Life of this patent
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Abstract
Provided is a resin for PSA sheet that has adhesive reliability such that it does not peel off or shift out of place even when applied to a flexible adherend, an adherend with brittle surface or an adherend with low strength; and that can be peeled off without adherend damage during removal. The PSA sheet resin provided has a storage modulus at 25° C. in the range of 10 MPa to 500 MPa, a storage modulus at 37° C. in the range of 0.5 MPa to 20 MPa, and a surface hardness at 37° C. in the range of 0.1 MPa to 2 MPa.
Claims16
A resin for use in a pressure-sensitive adhesive sheet, the resin having
- a storage modulus at 25° C. in the range of 10 MPa to 500 MPa,
- a storage modulus at 37° C. in the range of 0.5 MPa to 20 MPa, and
- a surface hardness at 37° C. in the range of 0.1 MPa to 2 MPa.
A pressure-sensitive adhesive sheet comprising a layer A, wherein
- the layer A has a storage modulus at 25° C. in the range of 10 MPa to 500 MPa and a storage modulus at 37° C. in the range of 0.5 MPa to 20 MPa, and
- the pressure-sensitive adhesive sheet has an adhesive face that has a 180° peel strength on stainless steel plate of 4 N/10 mm or greater.
Dependencies are inferred from the claim text.